Issued Patents 2022
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527465 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen | 2022-12-13 |
| 11502062 | Integrated circuit package and method | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih, Nien-Fang Wu | 2022-11-15 |
| 11495559 | Integrated circuits | Hsien-Wei Chen, Ming-Fa Chen, Ying-Ju Chen | 2022-11-08 |
| 11476201 | Package-on-package device | Ming-Fa Chen, Hsien-Wei Chen | 2022-10-18 |
| 11456240 | Semiconductor device and method of manufacture | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2022-09-27 |
| 11443995 | Integrated circuit package and method | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2022-09-13 |
| 11417587 | Package structure and method of fabricating the same | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2022-08-16 |
| 11417629 | Three-dimensional stacking structure and manufacturing method thereof | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih | 2022-08-16 |
| 11417619 | Package and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen | 2022-08-16 |
| 11387209 | Package structure | Hsien-Wei Chen, Ming-Fa Chen | 2022-07-12 |
| 11380653 | Die stack structure and manufacturing method thereof | Chen-Hua Yu, Hsien-Wei Chen, Ming-Fa Chen, Tzuan-Horng Liu | 2022-07-05 |
| 11373981 | Package and manufacturing method thereof | Ming-Fa Chen, Jian-Wei Hong | 2022-06-28 |
| 11362013 | Package structure for heat dissipation | Chen-Hua Yu, Ming-Fa Chen | 2022-06-14 |
| 11362064 | Semiconductor package with shared barrier layer in redistribution and via | Hsien-Wei Chen, Ching-Jung Yang, Ming-Fa Chen, Ying-Ju Chen | 2022-06-14 |
| 11342297 | Package structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Jie Chen, Sen-Bor Jan | 2022-05-24 |
| 11335656 | Semiconductor device and method of manufacturing | Chih-Chia Hu, Ching-Pin Yuan, Sen-Bor Jan, Ming-Fa Chen | 2022-05-17 |
| 11322477 | Package structure and method of fabricating the same | Ming-Fa Chen, Nien-Fang Wu, Tzuan-Horng Liu, Chao-Wen Shih | 2022-05-03 |
| 11309291 | Die stack structure and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen, Ying-Ju Chen | 2022-04-19 |
| 11309223 | Method of forming semiconductor device package having dummy devices on a first die | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen, Hui Liu, Ching-Pin Yuan | 2022-04-19 |
| 11289450 | Semiconductor structure and manufacturing method thereof | Ming-Fa Chen, Wen-Chih Chiou | 2022-03-29 |
| 11282784 | Semiconductor package and manufacturing method of the same | Ming-Fa Chen, Chen-Hua Yu | 2022-03-22 |
| 11264362 | Semiconductor structure and method of fabricating the same | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Tzuan-Horng Liu | 2022-03-01 |
| 11264343 | Bond pad structure for semiconductor device and method of forming same | Ming-Fa Chen, Hsien-Wei Chen, Jie Chen | 2022-03-01 |
| 11257787 | Package structure and method of fabricating the same | Hsien-Wei Chen, Ming-Fa Chen | 2022-02-22 |
| 11239225 | Three-dimensional integrated circuit structures and methods of manufacturing the same | Hsien-Wei Chen, Ming-Fa Chen | 2022-02-01 |