Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515618 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh | 2022-11-29 |
| 11502062 | Integrated circuit package and method | Ming-Fa Chen, Tzuan-Horng Liu, Sung-Feng Yeh, Nien-Fang Wu | 2022-11-15 |
| 11417629 | Three-dimensional stacking structure and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2022-08-16 |
| 11335655 | Package structure and manufacturing method thereof | Albert Wan, Shou-Zen Chang, Nan-Chin Chuang | 2022-05-17 |
| 11322477 | Package structure and method of fabricating the same | Ming-Fa Chen, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2022-05-03 |
| 11282810 | Integrated fan-out package and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Han-Ping Pu +5 more | 2022-03-22 |
| 11264362 | Semiconductor structure and method of fabricating the same | Ming-Fa Chen, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2022-03-01 |
| 11245176 | Package structure, electronic device and method of fabricating package structure | Min-Chien Hsiao, Chen-Hua Yu, Chung-Shi Liu, Shou-Zen Chang | 2022-02-08 |
| 11244896 | Package structure and manufacturing method thereof | Min-Chien Hsiao, Chuei-Tang Wang, Han-Ping Pu, Chieh-Yen Chen | 2022-02-08 |
| 11233035 | Package structure and method of manufacturing the same | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2022-01-25 |