Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488908 | Semiconductor device and method | Chen-Hua Yu, Hui-Jung Tsai, Hung-Jui Kuo, Chung-Shi Liu, Ting-Chu Ko | 2022-11-01 |
| 11437327 | Integrated fan-out packaging | Hsiao-Wen Lee | 2022-09-06 |
| 11424197 | Package, package structure with redistributing circuits and antenna elements and method of manufacturing the same | Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Chun-Lin Lu, Kai-Chiang Wu | 2022-08-23 |
| 11417616 | Package structure and manufacturing method thereof | Kai-Chiang Wu, Yen-Ping Wang | 2022-08-16 |
| 11342269 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chen-Hua Yu, Chun-Lin Lu, Kai-Chiang Wu | 2022-05-24 |
| 11335666 | Memory device and manufacturing method thereof | Ching-Yu Huang, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang +1 more | 2022-05-17 |
| 11282817 | Semiconductor device package including embedded conductive elements | Yu-Feng Chen, Chun-Hung Lin, Ming-Da Cheng, Kai-Chiang Wu | 2022-03-22 |
| 11282810 | Integrated fan-out package and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih +5 more | 2022-03-22 |
| 11244896 | Package structure and manufacturing method thereof | Min-Chien Hsiao, Chuei-Tang Wang, Chao-Wen Shih, Chieh-Yen Chen | 2022-02-08 |