Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11522073 | Semiconductor devices and methods of manufacturing thereof | Shih-Yao Lin, Chih-Han Lin, Chen-Ping Chen, Kuei-Yu Kao | 2022-12-06 |
| 11437327 | Integrated fan-out packaging | Han-Ping Pu | 2022-09-06 |
| 11387341 | Semiconductor devices and methods of manufacturing thereof | Shih-Yao Lin, Chih-Han Lin | 2022-07-12 |
| 11342306 | Multi-chip wafer level packages | Shuo-Mao Chen, Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng | 2022-05-24 |