Issued Patents 2022
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532569 | Method for manufacturing semiconductor package structure | Jui-Pin Hung, Feng-Cheng Hsu, Shin-Puu Jeng, De-Dui Liao | 2022-12-20 |
| 11508710 | Method of forming semiconductor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2022-11-22 |
| 11469208 | Method of manufacturing semiconductor package structure | Shin-Puu Jeng, Feng-Cheng Hsu | 2022-10-11 |
| 11456257 | Semiconductor package with dual sides of metal routing | Shin-Puu Jeng, Hsien-Wen Liu, Po-Yao Chuang, Feng-Cheng Hsu, Po-Yao Lin | 2022-09-27 |
| 11443993 | Chip package structure with cavity in interposer | Shin-Puu Jeng, Feng-Cheng Hsu | 2022-09-13 |
| 11417620 | Semiconductor device encapsulated by molding material attached to redestribution layer | Shin-Puu Jeng, Feng-Cheng Hsu | 2022-08-16 |
| 11404394 | Chip package structure with integrated device integrated beneath the semiconductor chip | Feng-Cheng Hsu, Shin-Puu Jeng | 2022-08-02 |
| 11393746 | Reinforcing package using reinforcing patches | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Feng-Cheng Hsu, Shin-Puu Jeng | 2022-07-19 |
| 11342306 | Multi-chip wafer level packages | Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee | 2022-05-24 |
| 11342255 | Semiconductor structure and manufacturing method thereof | Feng-Cheng Hsu, Shin-Puu Jeng | 2022-05-24 |
| 11335672 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Mill-Jer Wang, Feng-Cheng Hsu, Chao-Hsiang Yang, Shin-Puu Jeng +4 more | 2022-05-17 |
| 11315878 | Photonics integrated circuit package | Feng-Wei Kuo, Chewn-Pu Jou | 2022-04-26 |
| 11296065 | Semiconductor packages and methods of forming same | Shin-Puu Jeng, Techi Wong, Po-Yao Chuang, Meng-Wei Chou | 2022-04-05 |
| 11295957 | Package structure and method of manufacturing the same | Feng-Cheng Hsu, Shin-Puu Jeng | 2022-04-05 |
| 11282759 | Chip package structure having warpage control and method of forming the same | Feng-Cheng Hsu, Shin-Puu Jeng | 2022-03-22 |
| 11270975 | Semiconductor packages including passive devices and methods of forming same | Shin-Puu Jeng, Po-Yao Chuang | 2022-03-08 |
| 11270953 | Structure and formation method of chip package with shielding structure | Po-Yao Chuang, Po-Hao Tsai, Shin-Puu Jeng, Ming-Chih Yew | 2022-03-08 |
| 11264300 | Package structure with lid and method for forming the same | Shin-Puu Jeng, Po-Yao Lin, Feng-Cheng Hsu, Chin-Hua Wang | 2022-03-01 |
| 11251054 | Integrated passive device package and methods of forming same | Feng-Cheng Hsu, Jui-Pin Hung, Shin-Puu Jeng | 2022-02-15 |
| 11251142 | Method of fabricating package structure | Chia-Hsiang Lin, Feng-Cheng Hsu, Shin-Puu Jeng, Arunima Banerjee | 2022-02-15 |
| 11239194 | Chip package structure | Shin-Puu Jeng, Feng-Cheng Hsu | 2022-02-01 |