Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11251142 | Method of fabricating package structure | Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng, Arunima Banerjee | 2022-02-15 |
CL
Chia-Hsiang Lin
Overall (2022): #497,623 of 548,613Top 95%
1
Patents 2022