Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527474 | Integrated circuit package and method | Po-Hao Tsai, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2022-12-13 |
| 11430776 | Semiconductor devices and methods of manufacturing | Yi-Wen Wu, Po-Yao Chuang, Meng-Liang Lin, Shih-Ting Hung, Po-Hao Tsai +1 more | 2022-08-30 |
| 11380666 | Fan-out package with cavity substrate | Po-Hao Tsai, Po-Yao Chuang, Shin-Puu Jeng, Meng-Wei Chou, Meng-Liang Lin | 2022-07-05 |
| 11362010 | Structure and formation method of chip package with fan-out feature | Meng-Liang Lin, Po-Hao Tsai, Po-Yao Chuang, Yi-Wen Wu, Shin-Puu Jeng | 2022-06-14 |
| 11322449 | Package with fan-out structures | Shin-Puu Jeng, Po-Hao Tsai, Po-Yao Chuang | 2022-05-03 |
| 11322447 | Dual-sided routing in 3D SiP structure | Po-Hao Tsai, Po-Yao Chuang, Meng-Liang Lin, Yi-Wen Wu, Shin-Puu Jeng | 2022-05-03 |
| 11296065 | Semiconductor packages and methods of forming same | Shin-Puu Jeng, Po-Yao Chuang, Shuo-Mao Chen, Meng-Wei Chou | 2022-04-05 |
| 11239173 | Structure and formation method of chip package with fan-out feature | Po-Hao Tsai, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2022-02-01 |