Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527474 | Integrated circuit package and method | Po-Hao Tsai, Techi Wong, Meng-Wei Chou, Po-Yao Chuang, Shin-Puu Jeng | 2022-12-13 |
| 11430739 | Structure and formation method of package structure with fan-out structure | Po-Hao Tsai, Hsien-Wen Liu, Shin-Puu Jeng, Shih-Yung PENG, Shih-Ting Hung | 2022-08-30 |
| 11430776 | Semiconductor devices and methods of manufacturing | Yi-Wen Wu, Po-Yao Chuang, Techi Wong, Shih-Ting Hung, Po-Hao Tsai +1 more | 2022-08-30 |
| 11380666 | Fan-out package with cavity substrate | Po-Hao Tsai, Techi Wong, Po-Yao Chuang, Shin-Puu Jeng, Meng-Wei Chou | 2022-07-05 |
| 11362010 | Structure and formation method of chip package with fan-out feature | Po-Hao Tsai, Po-Yao Chuang, Yi-Wen Wu, Techi Wong, Shin-Puu Jeng | 2022-06-14 |
| 11322447 | Dual-sided routing in 3D SiP structure | Po-Hao Tsai, Po-Yao Chuang, Yi-Wen Wu, Shin-Puu Jeng, Techi Wong | 2022-05-03 |
| 11239173 | Structure and formation method of chip package with fan-out feature | Po-Hao Tsai, Po-Yao Chuang, Techi Wong, Shin-Puu Jeng | 2022-02-01 |