Issued Patents 2022
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532867 | Heterogeneous antenna in fan-out package | Po-Yao Chuang, Shin-Puu Jeng | 2022-12-20 |
| 11527474 | Integrated circuit package and method | Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2022-12-13 |
| 11527418 | Integrated circuit packages and methods of forming same | Jing-Cheng Lin, Li-Hui Cheng | 2022-12-13 |
| 11488843 | Underfill between a first package and a second package | Jing-Cheng Lin, Li-Hui Cheng | 2022-11-01 |
| 11462509 | Package structure with electronic device in cavity substrate and method for forming the same | Ming-Da Cheng, Mirng-Ji Lii | 2022-10-04 |
| 11450567 | Package component with stepped passivation layer | Ming-Da Cheng, Tzy-Kuang Lee, Song-Bor Lee, Wen-Hsiung Lu, Wen-Che Chang | 2022-09-20 |
| 11430776 | Semiconductor devices and methods of manufacturing | Yi-Wen Wu, Po-Yao Chuang, Meng-Liang Lin, Techi Wong, Shih-Ting Hung +1 more | 2022-08-30 |
| 11430739 | Structure and formation method of package structure with fan-out structure | Hsien-Wen Liu, Shin-Puu Jeng, Meng-Liang Lin, Shih-Yung PENG, Shih-Ting Hung | 2022-08-30 |
| 11393783 | Dummy structure of stacked and bonded semiconductor device | Li-Hui Cheng, Jing-Cheng Lin | 2022-07-19 |
| 11393770 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Chen-Hua Yu | 2022-07-19 |
| 11387217 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Chen-Hua Yu | 2022-07-12 |
| 11380666 | Fan-out package with cavity substrate | Techi Wong, Po-Yao Chuang, Shin-Puu Jeng, Meng-Wei Chou, Meng-Liang Lin | 2022-07-05 |
| 11362010 | Structure and formation method of chip package with fan-out feature | Meng-Liang Lin, Po-Yao Chuang, Yi-Wen Wu, Techi Wong, Shin-Puu Jeng | 2022-06-14 |
| 11322449 | Package with fan-out structures | Shin-Puu Jeng, Po-Yao Chuang, Techi Wong | 2022-05-03 |
| 11322447 | Dual-sided routing in 3D SiP structure | Po-Yao Chuang, Meng-Liang Lin, Yi-Wen Wu, Shin-Puu Jeng, Techi Wong | 2022-05-03 |
| 11282803 | Device, semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2022-03-22 |
| 11270953 | Structure and formation method of chip package with shielding structure | Po-Yao Chuang, Shin-Puu Jeng, Shuo-Mao Chen, Ming-Chih Yew | 2022-03-08 |
| 11264363 | Chip package structure with seal ring structure | Chen-Hua Yu, An-Jhih Su, Jing-Cheng Lin | 2022-03-01 |
| 11239138 | Methods of packaging semiconductor devices and packaged semiconductor devices | Li-Hui Cheng, Jing-Cheng Lin | 2022-02-01 |
| 11239173 | Structure and formation method of chip package with fan-out feature | Meng-Liang Lin, Po-Yao Chuang, Techi Wong, Shin-Puu Jeng | 2022-02-01 |
| 11217570 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang +2 more | 2022-01-04 |