Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527490 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Tsung-Yuan Yu, Ming-Da Cheng | 2022-12-13 |
| 11450567 | Package component with stepped passivation layer | Ming-Da Cheng, Tzy-Kuang Lee, Song-Bor Lee, Po-Hao Tsai, Wen-Che Chang | 2022-09-20 |
| 11417539 | Bump structure and method of making the same | Ming-Da Cheng, Su-Fei Lin, Hsu-Lun Liu, Chien-Pin Chan, Yung-Sheng Lin | 2022-08-16 |
| 11387143 | Redistribution lines with protection layers and method forming same | Ming-Da Cheng, Chin Wei Kang, Yung-Han Chuang, Lung-Kai Mao, Yung-Sheng Lin | 2022-07-12 |
| 11289404 | Semiconductor device and method | Hsu-Lun Liu, Ming-Da Cheng, Chen-En Yen, Cheng-Lung Yang, Kuanchih Huang | 2022-03-29 |