Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417539 | Bump structure and method of making the same | Wen-Hsiung Lu, Ming-Da Cheng, Hsu-Lun Liu, Chien-Pin Chan, Yung-Sheng Lin | 2022-08-16 |
SL
Su-Fei Lin
Overall (2022): #245,232 of 548,613Top 45%
1
Patents 2022