Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417539 | Bump structure and method of making the same | Wen-Hsiung Lu, Ming-Da Cheng, Su-Fei Lin, Chien-Pin Chan, Yung-Sheng Lin | 2022-08-16 |
| 11289404 | Semiconductor device and method | Wen-Hsiung Lu, Ming-Da Cheng, Chen-En Yen, Cheng-Lung Yang, Kuanchih Huang | 2022-03-29 |