Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430761 | Semiconductor package and method for manufacturing the same | Yun-Ching HUNG, Chin-Li KAO | 2022-08-30 |
| 11417539 | Bump structure and method of making the same | Wen-Hsiung Lu, Ming-Da Cheng, Su-Fei Lin, Hsu-Lun Liu, Chien-Pin Chan | 2022-08-16 |
| 11387143 | Redistribution lines with protection layers and method forming same | Ming-Da Cheng, Wen-Hsiung Lu, Chin Wei Kang, Yung-Han Chuang, Lung-Kai Mao | 2022-07-12 |
| 11257776 | Semiconductor package structure and method for manufacturing the same | Chin-Li KAO, Hsu-Nan FANG | 2022-02-22 |