Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387143 | Redistribution lines with protection layers and method forming same | Ming-Da Cheng, Wen-Hsiung Lu, Chin Wei Kang, Lung-Kai Mao, Yung-Sheng Lin | 2022-07-12 |
YC
Yung-Han Chuang
Overall (2022): #194,654 of 548,613Top 40%
1
Patents 2022