Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430761 | Semiconductor package and method for manufacturing the same | Yung-Sheng Lin, Chin-Li KAO | 2022-08-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430761 | Semiconductor package and method for manufacturing the same | Yung-Sheng Lin, Chin-Li KAO | 2022-08-30 |