Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430761 | Semiconductor package and method for manufacturing the same | Yun-Ching HUNG, Yung-Sheng Lin | 2022-08-30 |
| 11309253 | Package structure and method for manufacturing the same | — | 2022-04-19 |
| 11257776 | Semiconductor package structure and method for manufacturing the same | Yung-Sheng Lin, Hsu-Nan FANG | 2022-02-22 |
| 11244909 | Package structure and method for manufacturing the same | Fan-Yu MIN, Chen-Hung LEE, Wei-Hang Tai, Yuan-Tzuo Luo, Wen Yuan Chuang +1 more | 2022-02-08 |