Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538778 | Semiconductor package including alignment material and method for manufacturing semiconductor package | — | 2022-12-27 |
| 11502024 | Semiconductor device package and method of manufacturing the same | — | 2022-11-15 |
| 11404380 | Semiconductor package structure and method for manufacturing the same | Chun-Jun Zhuang | 2022-08-02 |
| 11316274 | Semiconductor device package and method of manufacturing the same | Cheng-Nan Lin | 2022-04-26 |
| 11282778 | Interposer between a conductive substrate and plurality of semiconductor components | — | 2022-03-22 |
| 11282772 | Package structure, assembly structure and method for manufacturing the same | — | 2022-03-22 |
| 11276661 | Package structure including two joint structures including different materials and method for manufacturing the same | — | 2022-03-15 |
| 11257788 | Semiconductor device package with stacked die having traces on lateral surface | Chun-Jun Zhuang | 2022-02-22 |
| 11257776 | Semiconductor package structure and method for manufacturing the same | Yung-Sheng Lin, Chin-Li KAO | 2022-02-22 |
| 11217498 | Semiconductor package and manufacturing method of the same | Chien-Ching CHEN, Chen Yuan Weng | 2022-01-04 |