Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404380 | Semiconductor package structure and method for manufacturing the same | Hsu-Nan FANG | 2022-08-02 |
| 11257788 | Semiconductor device package with stacked die having traces on lateral surface | Hsu-Nan FANG | 2022-02-22 |