Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527504 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang +8 more | 2022-12-13 |
| 11417539 | Bump structure and method of making the same | Wen-Hsiung Lu, Ming-Da Cheng, Su-Fei Lin, Hsu-Lun Liu, Yung-Sheng Lin | 2022-08-16 |