Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532577 | Fan-out package and methods of forming thereof | Wan-Ting Shih, Nai-Wei Liu, Jing-Cheng Lin | 2022-12-20 |
| 11527504 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu +8 more | 2022-12-13 |
| 11456276 | Chip package structure | Ling Li, Jung-Hua Chang | 2022-09-27 |
| 11443957 | Metal oxide layered structure and methods of forming the same | Jing-Cheng Lin | 2022-09-13 |
| 11367658 | Semiconductor die singulation and structures formed thereby | Fu-Chen Chang, Wen-Ming Chen | 2022-06-21 |
| 11355406 | Non-vertical through-via in package | Jung-Hua Chang, Jy-Jie Gau, Jing-Cheng Lin | 2022-06-07 |
| 11336106 | Charging system with low power consumption | Hung-Hsuan Cheng, Shih-Chieh Chen, Chun Luo, Yi Li, Liang Li | 2022-05-17 |
| 11329031 | Structure and formation method for chip package | Jui-Pin Hung, Hsien-Wen Liu, Shin-Puu Jeng | 2022-05-10 |