Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532577 | Fan-out package and methods of forming thereof | Wan-Ting Shih, Jing-Cheng Lin, Cheng-Lin Huang | 2022-12-20 |
| 11508678 | Semiconductor package structure including antenna | Yen-Yao Chi, Tzu-Hung Lin | 2022-11-22 |
| 11450606 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Tzu-Hung Lin, Ta-Jen Yu, Wen-Sung Hsu | 2022-09-20 |
| 11410936 | Semiconductor package structure | Tzu-Hung Lin, Chia-Cheng Chang, I-Hsuan Peng | 2022-08-09 |