Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469152 | Semiconductor chip package and fabrication method thereof | Yi-Lin Tsai, Yi-Jou Lin, I-Hsuan Peng | 2022-10-11 |
| 11469201 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Ta-Jen Yu, Andrew C. Chang | 2022-10-11 |
| 11450606 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Nai-Wei Liu, Tzu-Hung Lin, Ta-Jen Yu | 2022-09-20 |
| 11373957 | Semiconductor package with layer structures, antenna layer and electronic component | Tao Cheng, Nan-Cheng Chen, Che-Ya Chou, Wen-Chou Wu, Yen-Ju Lu +2 more | 2022-06-28 |