Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508707 | Semiconductor package with dummy MIM capacitor die | Yao-Chun Su, Chih-Ching Chen, Yi-Jou Lin | 2022-11-22 |
| 11469152 | Semiconductor chip package and fabrication method thereof | Yi-Lin Tsai, Yi-Jou Lin, Wen-Sung Hsu | 2022-10-11 |
| 11410936 | Semiconductor package structure | Tzu-Hung Lin, Chia-Cheng Chang, Nai-Wei Liu | 2022-08-09 |
| 11302592 | Semiconductor package having a stiffener ring | Chi-Wen Pan, Sheng-Liang Kuo, Yi-Jou Lin, Tai-Yu Chen | 2022-04-12 |
| 11264337 | Semiconductor package structure | Chia-Cheng Chang, Tzu-Hung Lin, Yi-Jou Lin | 2022-03-01 |
| 11222850 | Electronic package with rotated semiconductor die | Yao-Chun Su, Chih-Jung Hsu, Yi-Jou Lin | 2022-01-11 |