Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508707 | Semiconductor package with dummy MIM capacitor die | Yao-Chun Su, Chih-Ching Chen, I-Hsuan Peng | 2022-11-22 |
| 11469152 | Semiconductor chip package and fabrication method thereof | Yi-Lin Tsai, I-Hsuan Peng, Wen-Sung Hsu | 2022-10-11 |
| 11342267 | Semiconductor package structure and method for forming the same | Po-Hao Chang, Hung-Chuan Chen | 2022-05-24 |
| 11302592 | Semiconductor package having a stiffener ring | Chi-Wen Pan, I-Hsuan Peng, Sheng-Liang Kuo, Tai-Yu Chen | 2022-04-12 |
| 11264337 | Semiconductor package structure | Chia-Cheng Chang, Tzu-Hung Lin, I-Hsuan Peng | 2022-03-01 |
| 11222850 | Electronic package with rotated semiconductor die | Yao-Chun Su, Chih-Jung Hsu, I-Hsuan Peng | 2022-01-11 |