Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469201 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu | 2022-10-11 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469201 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu | 2022-10-11 |