Issued Patents 2022
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538711 | Methods for edge trimming of semiconductor wafers and related apparatus | — | 2022-12-27 |
| 11535938 | Shower head assembly and atomic layer deposition device | CHING-LIANG YI, Yun-Chi Hsu | 2022-12-27 |
| 11532469 | Shielding device and thin-film-deposition equipment with the same | Yu-Te Shen | 2022-12-20 |
| 11532665 | Manufacturing method and manufacturing machine for reducing non-radiative recombination of micro LED | — | 2022-12-20 |
| 11532577 | Fan-out package and methods of forming thereof | Wan-Ting Shih, Nai-Wei Liu, Cheng-Lin Huang | 2022-12-20 |
| 11527391 | Position-detectable shielding device and thin-film-deposition equipment with the same | Yu-Te Shen | 2022-12-13 |
| 11527464 | Fan-out wafer level package structure | — | 2022-12-13 |
| 11527454 | Package structures and methods of forming the same | Chen-Hua Yu, Wen-Hsin Wei, Chi-Hsi Wu, Shang-Yun Hou, Hsien-Pin Hu +2 more | 2022-12-13 |
| 11527418 | Integrated circuit packages and methods of forming same | Li-Hui Cheng, Po-Hao Tsai | 2022-12-13 |
| 11515288 | Protective layer for contact pads in fan-out interconnect structure and method of forming same | Chin-Chuan Chang, Tsei-Chung Fu | 2022-11-29 |
| 11488843 | Underfill between a first package and a second package | Li-Hui Cheng, Po-Hao Tsai | 2022-11-01 |
| 11488882 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Chih-Wei Wu, Szu-Wei Lu | 2022-11-01 |
| 11482403 | Thin-film-deposition equipment for detecting shielding mechanism | Yu-Te Shen | 2022-10-25 |
| 11476101 | Double-layer shielding device and thin-film-deposition equipment with the same | Yu-Te Shen | 2022-10-18 |
| 11476100 | Shielding mechanism and substrate-processing chamber with the same | Ta-Hao Kuo, Yu-Te Shen, Chi Hung Cheng | 2022-10-18 |
| 11443957 | Metal oxide layered structure and methods of forming the same | Cheng-Lin Huang | 2022-09-13 |
| 11427910 | Atomic layer deposition equipment capable of reducing precursor deposition and atomic layer deposition process method using the same | Ta-Hao Kuo | 2022-08-30 |
| 11424194 | Three dimensional integrated circuit (3DIC) with support structures | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu | 2022-08-23 |
| 11417580 | Package structures and methods of forming the same | Chen-Hua Yu, Wen-Hsin Wei, Chi-Hsi Wu, Shang-Yun Hou, Hsien-Pin Hu +2 more | 2022-08-16 |
| 11401608 | Atomic layer deposition equipment and process method | CHING-LIANG YI, Yun-Chi Hsu, Hsin-Yu Yao | 2022-08-02 |
| 11393783 | Dummy structure of stacked and bonded semiconductor device | Li-Hui Cheng, Po-Hao Tsai | 2022-07-19 |
| 11393770 | Semiconductor device and method of manufacture | Chen-Hua Yu, Po-Hao Tsai | 2022-07-19 |
| 11387217 | Semiconductor device and method of manufacture | Chen-Hua Yu, Po-Hao Tsai | 2022-07-12 |
| 11362046 | Semiconductor package | Chin-Chuan Chang, Jui-Pin Hung | 2022-06-14 |
| 11355406 | Non-vertical through-via in package | Cheng-Lin Huang, Jung-Hua Chang, Jy-Jie Gau | 2022-06-07 |