Issued Patents 2022
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532585 | Package containing device dies and interconnect die and redistribution lines | Kuo-Chiang Ting, Chi-Hsi Wu, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh | 2022-12-20 |
| 11527454 | Package structures and methods of forming the same | Chen-Hua Yu, Wen-Hsin Wei, Chi-Hsi Wu, Jing-Cheng Lin, Hsien-Pin Hu +2 more | 2022-12-13 |
| 11508696 | Semiconductor device | Weiming Chris Chen, Tu-Hao Yu, Kuo-Chiang Ting, Chi-Hsi Wu | 2022-11-22 |
| 11502056 | Joint structure in semiconductor package and manufacturing method thereof | Kuan-Yu Huang, Chih-Wei Wu, Sung-Hui Huang, Ying-Ching Shih, Cheng-Chieh Li | 2022-11-15 |
| 11502015 | Semiconductor package and manufacturing method thereof | Wen-Wei Shen, Sung-Hui Huang, Kuan-Yu Huang | 2022-11-15 |
| 11493689 | Photonic semiconductor device and method of manufacture | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Sung-Hui Huang, Chi-Hsi Wu | 2022-11-08 |
| 11495472 | Semicondutor packages and methods of forming same | Chung-Yu Lu, Ping-Kang Huang, Sao-Ling Chiu | 2022-11-08 |
| 11476184 | Semiconductor device and method for manufacturing the same | Kuo-Chiang Ting, Chi-Hsi Wu, Tu-Hao Yu, Chia-Hao Hsu, Pin-Tso Lin +1 more | 2022-10-18 |
| 11462418 | Integrated circuit package and method | Shih-Ting Lin, Szu-Wei Lu, Weiming Chris Chen, Kuo-Chiang Ting, Chi-Hsi Wu | 2022-10-04 |
| 11454773 | Optical transceiver and manufacturing method thereof | Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Kuan-Yu Huang, Kuo-Chiang Ting +1 more | 2022-09-27 |
| 11450580 | Semiconductor structure and method of fabricating the same | Kuan-Yu Huang, Sung-Hui Huang, Chien-Yuan Huang | 2022-09-20 |
| 11444038 | Forming large chips through stitching | Wen-Hsin Wei, Hsien-Pin Hu, Weiming Chris Chen | 2022-09-13 |
| 11437334 | Chip package structure | Kuan-Yu Huang, Sung-Hui Huang | 2022-09-06 |
| 11428879 | Method for forming a package structure for optical fiber | Sung-Hui Huang, Jui Hsieh Lai | 2022-08-30 |
| 11424219 | Package structure and method of fabricating the same | Wen-Wei Shen, Sung-Hui Huang | 2022-08-23 |
| 11417580 | Package structures and methods of forming the same | Chen-Hua Yu, Wen-Hsin Wei, Chi-Hsi Wu, Jing-Cheng Lin, Hsien-Pin Hu +2 more | 2022-08-16 |
| 11415762 | Optical bench, method of making and method of using | Ying-Hao Kuo, Wan-Yu Lee | 2022-08-16 |
| 11410968 | Semiconductor device and method of forming the same | Jiun Yi Wu, Chen-Hua Yu | 2022-08-09 |
| 11380611 | Chip-on-wafer structure with chiplet interposer | Weiming Chris Chen, Kuo-Chiang Ting | 2022-07-05 |
| 11373946 | Semiconductor package and manufacturing method thereof | Chi-Ming Huang, Ping-Kang Huang, Sao-Ling Chiu | 2022-06-28 |
| 11328936 | Structure and formation method of package structure with underfill | Kuan-Yu Huang, Sung-Hui Huang, Jui Hsieh Lai | 2022-05-10 |
| 11270956 | Package structure and fabricating method thereof | Kuan-Yu Huang, Sung-Hui Huang | 2022-03-08 |
| 11244924 | Tri-layer CoWoS structure | Chen-Hua Yu, Yun-Han Lee | 2022-02-08 |
| 11222867 | Package and manufacturing method thereof | Sung-Hui Huang, Kuan-Yu Huang | 2022-01-11 |