CH

Chia-Hao Hsu

DP Dell Products: 2 patents #307 of 1,443Top 25%
ME Mediatek: 2 patents #57 of 350Top 20%
CE Compal Electronics: 2 patents #25 of 143Top 20%
TSMC: 2 patents #1,228 of 3,577Top 35%
IT ITRI: 1 patents #118 of 669Top 20%
FC Foxtron Vehicle Technologies Co.: 1 patents #1 of 2Top 50%
CC Chang Chun Petrochemical Co.: 1 patents #8 of 20Top 40%
Overall (2022): #5,121 of 548,613Top 1%
13
Patents 2022

Issued Patents 2022

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
11532585 Package containing device dies and interconnect die and redistribution lines Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Ting-Yu Yeh 2022-12-20
11492436 Modified polyvinyl alcohol-based polymer and its application Jyun-Ru Sun, Huan Chang, Cheng-Fan Wang 2022-11-08
11476184 Semiconductor device and method for manufacturing the same Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Pin-Tso Lin +1 more 2022-10-18
11439240 Adjustable seat Tsu-Yi Tsai 2022-09-13
11417964 Single polarized array waveguide antenna Ting Zhang, Yu-Cheng Chen, Li-Ching Lin, Sheng-Feng Yeh, Tung-Yi Wu 2022-08-16
11334120 Information handling system kickstand hinge Chiu-Jung Tsen, John Trevor Morrison 2022-05-17
11334124 Electronic device Kai-Cheng Chao, Chia-Huang Chan, You-Yu Chen 2022-05-17
11302657 Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen +1 more 2022-04-12
11262793 Folding-type electronic device You-Yu Chen, Chia-Huang Chan, Wei-Feng Hsieh, Kai-Cheng Chao 2022-03-01
11256966 Smart medication identifying system Wan-Jung Chang, Liang-Bi Chen, Yi-De Yan, Zhi-Cheng Qiu, Tzu-Chin Yang +2 more 2022-02-22
11243578 Gear synchronized dual axis pivot hinge Christopher A. Torres, Kevin M. Turchin, Enoch Chen, Anthony J. Sanchez, Kai-Cheng Chao +1 more 2022-02-08
11245293 Motor stator with dovetail or rectangular mount structure and stator teeth airgap width ratio Sheng-Tsz LIU, Yau-Bin Yang, Shou-Long Yu, Lin Peng, Yang-Guang Liu 2022-02-08
11227846 Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen +1 more 2022-01-18