Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532585 | Package containing device dies and interconnect die and redistribution lines | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Chia-Hao Hsu, Ting-Yu Yeh | 2022-12-20 |
| 11508696 | Semiconductor device | Weiming Chris Chen, Kuo-Chiang Ting, Shang-Yun Hou, Chi-Hsi Wu | 2022-11-22 |
| 11476184 | Semiconductor device and method for manufacturing the same | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Chia-Hao Hsu, Pin-Tso Lin +1 more | 2022-10-18 |