Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532585 | Package containing device dies and interconnect die and redistribution lines | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu | 2022-12-20 |
TY
Ting-Yu Yeh
Overall (2022): #229,626 of 548,613Top 45%
1
Patents 2022