Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532585 | Package containing device dies and interconnect die and redistribution lines | Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh | 2022-12-20 |
| 11508696 | Semiconductor device | Weiming Chris Chen, Tu-Hao Yu, Shang-Yun Hou, Chi-Hsi Wu | 2022-11-22 |
| 11508737 | SRAM cell and logic cell design | Fang Chen, Jhon Jhy Liaw, Min-Chang Liang | 2022-11-22 |
| 11493689 | Photonic semiconductor device and method of manufacture | Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Shang-Yun Hou, Chi-Hsi Wu | 2022-11-08 |
| 11476184 | Semiconductor device and method for manufacturing the same | Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Pin-Tso Lin +1 more | 2022-10-18 |
| 11462418 | Integrated circuit package and method | Shih-Ting Lin, Szu-Wei Lu, Weiming Chris Chen, Shang-Yun Hou, Chi-Hsi Wu | 2022-10-04 |
| 11454773 | Optical transceiver and manufacturing method thereof | Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Kuan-Yu Huang, Shang-Yun Hou +1 more | 2022-09-27 |
| 11380611 | Chip-on-wafer structure with chiplet interposer | Weiming Chris Chen, Shang-Yun Hou | 2022-07-05 |