Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502056 | Joint structure in semiconductor package and manufacturing method thereof | Chih-Wei Wu, Sung-Hui Huang, Shang-Yun Hou, Ying-Ching Shih, Cheng-Chieh Li | 2022-11-15 |
| 11502015 | Semiconductor package and manufacturing method thereof | Wen-Wei Shen, Sung-Hui Huang, Shang-Yun Hou | 2022-11-15 |
| 11454773 | Optical transceiver and manufacturing method thereof | Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2022-09-27 |
| 11450580 | Semiconductor structure and method of fabricating the same | Sung-Hui Huang, Shang-Yun Hou, Chien-Yuan Huang | 2022-09-20 |
| 11437334 | Chip package structure | Sung-Hui Huang, Shang-Yun Hou | 2022-09-06 |
| 11328936 | Structure and formation method of package structure with underfill | Sung-Hui Huang, Jui Hsieh Lai, Shang-Yun Hou | 2022-05-10 |
| 11270956 | Package structure and fabricating method thereof | Sung-Hui Huang, Shang-Yun Hou | 2022-03-08 |
| 11222867 | Package and manufacturing method thereof | Sung-Hui Huang, Shang-Yun Hou | 2022-01-11 |