Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11428879 | Method for forming a package structure for optical fiber | Sung-Hui Huang, Shang-Yun Hou | 2022-08-30 |
| 11328936 | Structure and formation method of package structure with underfill | Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou | 2022-05-10 |