Issued Patents 2022
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527454 | Package structures and methods of forming the same | Chen-Hua Yu, Wen-Hsin Wei, Chi-Hsi Wu, Shang-Yun Hou, Jing-Cheng Lin +2 more | 2022-12-13 |
| 11515267 | Dummy die placement without backside chipping | Chih-Wei Wu, Li-Chung Kuo, Pu Wang, Szu-Wei Lu, Kung-Chen Yeh | 2022-11-29 |
| 11508692 | Package structure and method of fabricating the same | Kung-Chen Yeh, Szu-Wei Lu, Tsung-Fu Tsai | 2022-11-22 |
| 11502056 | Joint structure in semiconductor package and manufacturing method thereof | Kuan-Yu Huang, Chih-Wei Wu, Sung-Hui Huang, Shang-Yun Hou, Cheng-Chieh Li | 2022-11-15 |
| 11482465 | Thermal interface materials, 3D semiconductor packages and methods of manufacture | Chen-Hua Yu, Szu-Wei Lu, Li-Chung Kuo | 2022-10-25 |
| 11482508 | Semiconductor package and manufacturing method thereof | Chih-Wei Wu, Szu-Wei Lu | 2022-10-25 |
| 11482497 | Package structure including a first die and a second die and a bridge die and method of forming the package structure | Yu-Hung Lin, Chih-Wei Wu, Chia-Nan Yuan, An-Jhih Su, Szu-Wei Lu +2 more | 2022-10-25 |
| 11456245 | Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same | Hsien-Ju Tsou, Chih-Wei Wu, Szu-Wei Lu | 2022-09-27 |
| 11424194 | Three dimensional integrated circuit (3DIC) with support structures | Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin | 2022-08-23 |
| 11424173 | Integrated circuit package and method of forming same | Chen-Hua Yu, Chih-Wei Wu, Szu-Wei Lu | 2022-08-23 |
| 11417580 | Package structures and methods of forming the same | Chen-Hua Yu, Wen-Hsin Wei, Chi-Hsi Wu, Shang-Yun Hou, Jing-Cheng Lin +2 more | 2022-08-16 |
| 11410897 | Semiconductor structure having a dielectric layer edge covering circuit carrier | Chih-Wei Wu, Szu-Wei Lu | 2022-08-09 |
| 11296032 | Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same | Hsien-Ju Tsou, Chih-Wei Wu, Szu-Wei Lu | 2022-04-05 |
| 11289424 | Package and method of manufacturing the same | Chih-Wei Wu, Chen-Hua Yu, Kuo-Chung Yee, Szu-Wei Lu | 2022-03-29 |
| 11270976 | Package structure and method of manufacturing the same | Shu-Hang Liao, Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu | 2022-03-08 |
| 11257715 | Integrated fan-out packages and methods of forming the same | Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee | 2022-02-22 |