Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456245 | Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu | 2022-09-27 |
| 11296032 | Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu | 2022-04-05 |