Issued Patents 2022
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527454 | Package structures and methods of forming the same | Chen-Hua Yu, Wen-Hsin Wei, Chi-Hsi Wu, Shang-Yun Hou, Jing-Cheng Lin +2 more | 2022-12-13 |
| 11521905 | Package structure and method of manufacturing the same | Pu Wang, Li-Hui Cheng, Tsung-Fu Tsai | 2022-12-06 |
| 11515267 | Dummy die placement without backside chipping | Chih-Wei Wu, Li-Chung Kuo, Pu Wang, Ying-Ching Shih, Kung-Chen Yeh | 2022-11-29 |
| 11508692 | Package structure and method of fabricating the same | Kung-Chen Yeh, Tsung-Fu Tsai, Ying-Ching Shih | 2022-11-22 |
| 11495526 | Integrated circuit package and method | Chih-Chien Pan, Li-Hui Cheng, Chin-Fu Kao | 2022-11-08 |
| 11488882 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Chih-Wei Wu, Jing-Cheng Lin | 2022-11-01 |
| 11482465 | Thermal interface materials, 3D semiconductor packages and methods of manufacture | Chen-Hua Yu, Ying-Ching Shih, Li-Chung Kuo | 2022-10-25 |
| 11482508 | Semiconductor package and manufacturing method thereof | Ying-Ching Shih, Chih-Wei Wu | 2022-10-25 |
| 11482497 | Package structure including a first die and a second die and a bridge die and method of forming the package structure | Yu-Hung Lin, Chih-Wei Wu, Chia-Nan Yuan, Ying-Ching Shih, An-Jhih Su +2 more | 2022-10-25 |
| 11476205 | Package structure and method for forming the same | Tsung-Fu Tsai, Kung-Chen Yeh, I-Ting Huang, Shih-Ting Lin | 2022-10-18 |
| 11469197 | Integrated circuit package and method | Wen-Chih Chiou, Chen-Hua Yu, Shih-Ting Lin | 2022-10-11 |
| 11462418 | Integrated circuit package and method | Shih-Ting Lin, Weiming Chris Chen, Kuo-Chiang Ting, Shang-Yun Hou, Chi-Hsi Wu | 2022-10-04 |
| 11456287 | Package structure and method of fabricating the same | Hsien-Pin Hu, Chin-Fu Kao, Li-Hui Cheng, Wen-Hsin Wei, Chih-Chien Pan | 2022-09-27 |
| 11456245 | Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same | Hsien-Ju Tsou, Chih-Wei Wu, Ying-Ching Shih | 2022-09-27 |
| 11450654 | Package structure and method of fabricating the same | Tsung-Fu Tsai, Chin-Fu Kao, Pu Wang | 2022-09-20 |
| 11450615 | Package structure and method of fabricating the same | Tsung-Fu Tsai | 2022-09-20 |
| 11424194 | Three dimensional integrated circuit (3DIC) with support structures | Chih-Wei Wu, Ying-Ching Shih, Jing-Cheng Lin | 2022-08-23 |
| 11424173 | Integrated circuit package and method of forming same | Chen-Hua Yu, Chih-Wei Wu, Ying-Ching Shih | 2022-08-23 |
| 11424174 | Semiconductor device and method of forming the same | Chih-Chien Pan, Chin-Fu Kao, Li-Hui Cheng | 2022-08-23 |
| 11417580 | Package structures and methods of forming the same | Chen-Hua Yu, Wen-Hsin Wei, Chi-Hsi Wu, Shang-Yun Hou, Jing-Cheng Lin +2 more | 2022-08-16 |
| 11417606 | Package structure and method of fabricating the same | Shih-Ting Lin, Chi-Hsi Wu, Chen-Hua Yu | 2022-08-16 |
| 11410897 | Semiconductor structure having a dielectric layer edge covering circuit carrier | Chih-Wei Wu, Ying-Ching Shih | 2022-08-09 |
| 11355454 | Package structure and manufacturing method thereof | Tsung-Fu Tsai, Shih-Ting Lin, Chen-Hsuan Tsai, I-Ting Huang | 2022-06-07 |
| 11302683 | Optical signal processing package structure | Chih-Chien Pan, Chin-Fu Kao, Li-Hui Cheng | 2022-04-12 |
| 11296032 | Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same | Hsien-Ju Tsou, Chih-Wei Wu, Ying-Ching Shih | 2022-04-05 |