Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515267 | Dummy die placement without backside chipping | Chih-Wei Wu, Pu Wang, Ying-Ching Shih, Szu-Wei Lu, Kung-Chen Yeh | 2022-11-29 |
| 11482465 | Thermal interface materials, 3D semiconductor packages and methods of manufacture | Chen-Hua Yu, Szu-Wei Lu, Ying-Ching Shih | 2022-10-25 |