Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521905 | Package structure and method of manufacturing the same | Li-Hui Cheng, Szu-Wei Lu, Tsung-Fu Tsai | 2022-12-06 |
| 11515267 | Dummy die placement without backside chipping | Chih-Wei Wu, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Kung-Chen Yeh | 2022-11-29 |
| 11450654 | Package structure and method of fabricating the same | Tsung-Fu Tsai, Chin-Fu Kao, Szu-Wei Lu | 2022-09-20 |
| 11346932 | Frequency modulated image reconstruction | David Millar, Kieran Parsons, Philip Orlik | 2022-05-31 |
| 11289399 | Package structure and manufacturing method thereof | Chin-Fu Kao, Szu-Wei Lu | 2022-03-29 |
| 11262184 | Optical coherence tomography (OCT) system for producing profilometry measurements of a specimen | David Millar, Celalettin Yurdakul, Kieran Parsons | 2022-03-01 |
| 11249181 | Localization using millimeter wave beam attributes for keyless entry applications | Toshiaki Koike-Akino, Milutin Pajovic, Philip Orlik | 2022-02-15 |