Issued Patents 2022
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527418 | Integrated circuit packages and methods of forming same | Jing-Cheng Lin, Po-Hao Tsai | 2022-12-13 |
| 11521905 | Package structure and method of manufacturing the same | Pu Wang, Szu-Wei Lu, Tsung-Fu Tsai | 2022-12-06 |
| 11495526 | Integrated circuit package and method | Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2022-11-08 |
| 11488843 | Underfill between a first package and a second package | Jing-Cheng Lin, Po-Hao Tsai | 2022-11-01 |
| 11456287 | Package structure and method of fabricating the same | Hsien-Pin Hu, Chin-Fu Kao, Szu-Wei Lu, Wen-Hsin Wei, Chih-Chien Pan | 2022-09-27 |
| 11424174 | Semiconductor device and method of forming the same | Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2022-08-23 |
| 11393783 | Dummy structure of stacked and bonded semiconductor device | Po-Hao Tsai, Jing-Cheng Lin | 2022-07-19 |
| 11302683 | Optical signal processing package structure | Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2022-04-12 |
| 11296051 | Semiconductor packages and forming method thereof | Chin-Fu Kao, Chih-Yuan Chien, Szu-Wei Lu | 2022-04-05 |
| 11239134 | Package structure and method of fabricating the same | Chih-Hao Chen, Chin-Fu Kao, Szu-Wei Lu | 2022-02-01 |
| 11239138 | Methods of packaging semiconductor devices and packaged semiconductor devices | Po-Hao Tsai, Jing-Cheng Lin | 2022-02-01 |
| 11239136 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Szu-Wei Lu, Chih-Chien Pan | 2022-02-01 |