Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296051 | Semiconductor packages and forming method thereof | Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2022-04-05 |
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Chih-Yuan Chien
Overall (2022): #502,866 of 548,613Top 95%
1
Patents 2022