Issued Patents 2022
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502040 | Package structure and semiconductor pacakge | Jung-Hua Chang | 2022-11-15 |
| 11495526 | Integrated circuit package and method | Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2022-11-08 |
| 11476219 | Metal-bump sidewall protection | Jung-Hua Chang, Jian-Yang He | 2022-10-18 |
| 11456268 | Semiconductor package and manufacturing method thereof | Jung-Hua Chang | 2022-09-27 |
| 11456287 | Package structure and method of fabricating the same | Hsien-Pin Hu, Li-Hui Cheng, Szu-Wei Lu, Wen-Hsin Wei, Chih-Chien Pan | 2022-09-27 |
| 11450654 | Package structure and method of fabricating the same | Tsung-Fu Tsai, Pu Wang, Szu-Wei Lu | 2022-09-20 |
| 11424174 | Semiconductor device and method of forming the same | Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2022-08-23 |
| 11302683 | Optical signal processing package structure | Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2022-04-12 |
| 11296051 | Semiconductor packages and forming method thereof | Chih-Yuan Chien, Li-Hui Cheng, Szu-Wei Lu | 2022-04-05 |
| 11289399 | Package structure and manufacturing method thereof | Pu Wang, Szu-Wei Lu | 2022-03-29 |
| 11239134 | Package structure and method of fabricating the same | Chih-Hao Chen, Li-Hui Cheng, Szu-Wei Lu | 2022-02-01 |
| 11239136 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Li-Hui Cheng, Szu-Wei Lu, Chih-Chien Pan | 2022-02-01 |