Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521905 | Package structure and method of manufacturing the same | Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2022-12-06 |
| 11508692 | Package structure and method of fabricating the same | Kung-Chen Yeh, Szu-Wei Lu, Ying-Ching Shih | 2022-11-22 |
| 11476205 | Package structure and method for forming the same | Kung-Chen Yeh, I-Ting Huang, Shih-Ting Lin, Szu-Wei Lu | 2022-10-18 |
| 11450615 | Package structure and method of fabricating the same | Szu-Wei Lu | 2022-09-20 |
| 11450654 | Package structure and method of fabricating the same | Chin-Fu Kao, Pu Wang, Szu-Wei Lu | 2022-09-20 |
| 11355454 | Package structure and manufacturing method thereof | Shih-Ting Lin, Szu-Wei Lu, Chen-Hsuan Tsai, I-Ting Huang | 2022-06-07 |