Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476205 | Package structure and method for forming the same | Tsung-Fu Tsai, Kung-Chen Yeh, Shih-Ting Lin, Szu-Wei Lu | 2022-10-18 |
| 11355454 | Package structure and manufacturing method thereof | Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu, Chen-Hsuan Tsai | 2022-06-07 |