Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476205 | Package structure and method for forming the same | Tsung-Fu Tsai, Kung-Chen Yeh, I-Ting Huang, Szu-Wei Lu | 2022-10-18 |
| 11469197 | Integrated circuit package and method | Wen-Chih Chiou, Chen-Hua Yu, Szu-Wei Lu | 2022-10-11 |
| 11462418 | Integrated circuit package and method | Szu-Wei Lu, Weiming Chris Chen, Kuo-Chiang Ting, Shang-Yun Hou, Chi-Hsi Wu | 2022-10-04 |
| 11417606 | Package structure and method of fabricating the same | Chi-Hsi Wu, Chen-Hua Yu, Szu-Wei Lu | 2022-08-16 |
| 11411161 | Piezoelectric sensing system and piezoelectric sensing circuit | Chih-Hsiou Lin, Chung-Yuan Su, Chao-Ta Huang | 2022-08-09 |
| 11355454 | Package structure and manufacturing method thereof | Tsung-Fu Tsai, Szu-Wei Lu, Chen-Hsuan Tsai, I-Ting Huang | 2022-06-07 |
| 11282793 | Integrated fan-out structure with rugged interconnect | Szu-Wei Lu, Jing-Cheng Lin, Chen-Hua Yu | 2022-03-22 |