Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515267 | Dummy die placement without backside chipping | Chih-Wei Wu, Li-Chung Kuo, Pu Wang, Ying-Ching Shih, Szu-Wei Lu | 2022-11-29 |
| 11508692 | Package structure and method of fabricating the same | Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih | 2022-11-22 |
| 11476205 | Package structure and method for forming the same | Tsung-Fu Tsai, I-Ting Huang, Shih-Ting Lin, Szu-Wei Lu | 2022-10-18 |