Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495526 | Integrated circuit package and method | Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu | 2022-11-08 |
| 11456287 | Package structure and method of fabricating the same | Hsien-Pin Hu, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu, Wen-Hsin Wei | 2022-09-27 |
| 11424174 | Semiconductor device and method of forming the same | Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2022-08-23 |
| 11302683 | Optical signal processing package structure | Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2022-04-12 |
| 11239136 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2022-02-01 |