Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527454 | Package structures and methods of forming the same | Chen-Hua Yu, Wen-Hsin Wei, Chi-Hsi Wu, Shang-Yun Hou, Jing-Cheng Lin +2 more | 2022-12-13 |
| 11456287 | Package structure and method of fabricating the same | Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu, Wen-Hsin Wei, Chih-Chien Pan | 2022-09-27 |
| 11444038 | Forming large chips through stitching | Wen-Hsin Wei, Shang-Yun Hou, Weiming Chris Chen | 2022-09-13 |
| 11417580 | Package structures and methods of forming the same | Chen-Hua Yu, Wen-Hsin Wei, Chi-Hsi Wu, Shang-Yun Hou, Jing-Cheng Lin +2 more | 2022-08-16 |