Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502040 | Package structure and semiconductor pacakge | Chin-Fu Kao | 2022-11-15 |
| 11476219 | Metal-bump sidewall protection | Jian-Yang He, Chin-Fu Kao | 2022-10-18 |
| 11456268 | Semiconductor package and manufacturing method thereof | Chin-Fu Kao | 2022-09-27 |
| 11456276 | Chip package structure | Ling Li, Cheng-Lin Huang | 2022-09-27 |
| 11355406 | Non-vertical through-via in package | Cheng-Lin Huang, Jy-Jie Gau, Jing-Cheng Lin | 2022-06-07 |
| 11322380 | Substrate transfer system with tray aligner | Jing-Cheng Lin | 2022-05-03 |