JG

Jy-Jie Gau

TSMC: 1 patents #1,889 of 3,577Top 55%
📍 Baoshan, TW: #112 of 323 inventorsTop 35%
Overall (2022): #384,182 of 548,613Top 75%
1
Patents 2022

Issued Patents 2022

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11355406 Non-vertical through-via in package Cheng-Lin Huang, Jung-Hua Chang, Jing-Cheng Lin 2022-06-07