Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482497 | Package structure including a first die and a second die and a bridge die and method of forming the package structure | Yu-Hung Lin, Chih-Wei Wu, Ying-Ching Shih, An-Jhih Su, Szu-Wei Lu +2 more | 2022-10-25 |
| 11450612 | Semiconductor devices and methods of manufacturing the same | Yu-Hung Lin, An-Jhih Su, Der-Chyang Yeh, Shih-Guo Shen, Ming-Shih Yeh | 2022-09-20 |